JPS63121443U - - Google Patents
Info
- Publication number
- JPS63121443U JPS63121443U JP1987013214U JP1321487U JPS63121443U JP S63121443 U JPS63121443 U JP S63121443U JP 1987013214 U JP1987013214 U JP 1987013214U JP 1321487 U JP1321487 U JP 1321487U JP S63121443 U JPS63121443 U JP S63121443U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- semiconductor pellet
- semiconductor
- bending
- die
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000008188 pellet Substances 0.000 claims description 4
- 238000005452 bending Methods 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987013214U JPH0526748Y2 (en]) | 1987-01-31 | 1987-01-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987013214U JPH0526748Y2 (en]) | 1987-01-31 | 1987-01-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63121443U true JPS63121443U (en]) | 1988-08-05 |
| JPH0526748Y2 JPH0526748Y2 (en]) | 1993-07-07 |
Family
ID=30802064
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987013214U Expired - Lifetime JPH0526748Y2 (en]) | 1987-01-31 | 1987-01-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0526748Y2 (en]) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6387829U (en]) * | 1986-11-25 | 1988-06-08 |
-
1987
- 1987-01-31 JP JP1987013214U patent/JPH0526748Y2/ja not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6387829U (en]) * | 1986-11-25 | 1988-06-08 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0526748Y2 (en]) | 1993-07-07 |